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Lead Architect Platform Partitioning (f/m/div)

Location
München, Bayern
Job Type
Permanent
Posted
8 Sep 2022
Have you heard of Infineon s ambitious masterplan to develop our next hybrid automotive microprocessor-microcontroller generation? Do you want to shape the future of smarter, safer and connected cars by solving complex technical challenges? Then we have a great opportunity for you! As a Lead Architect for Platform Partitioning you will act as a key driver in our new Platform Architecture Team to define the partitioning of our novel platform architecture. With this position you will be entering our Technical Ladder: a special career path for those who share innovative ideas, demonstrate comprehensive technical knowledge, show thought leadership, possess problem solving abilities and are able to create business value. This position can be filled in Munich, Duisburg, Bristol (UK) or Langen. Responsibilities
In your new role you will:
  • Define the platform partitioning of our next hybrid microprocessor/microcontroller product generation with respect to the chipset: main compute die, companion SoCs, external memories and power supply chips
  • Be the Lead Architect for the control and mixed-signal centric companion SoCs
  • Define the chipset interconnect concept among the internal and external components incl. their hierarchies
  • Ensure a consistent HW-SW concept for the main compute and companion SoCs wrt. key applications such as modern zone & domain controllers, central car compute companions and gateways
  • Drive a platform differentiation strategies wrt. dependability and availability, e.g. via functional isolation, implementation based and/or technology-based isolation within a hybrid SoC-SiP concept
  • Cooperate closely with expert teams such as platform lead architects, subsystem architects, FW and SW development, design teams, and other business lines within Infineon
  • Ensure cost competitiveness and compatibility of the platform chipset wrt. automotive quality and safety requirements
  • Define requirements and establish methodologies for platform chipsets incl. SoC-Package-SiP co-design and SOC-Package-PCB interactions
  • Consult line and project management and provide clear technical direction setting wrt. to lean development and cost-awareness

Your Profile
You have a clear notion of how innovation contributes to the commercial success of the company, you constantly gain new insights by questioning existing assumptions and you inspire others for your ideas explaining even complex issues in a clear and convincing manner. Furthermore, you accept responsibility for decisions and for their positive or negative outcomes taking on new challenges without knowing the right path to an eventual solution in advance. If you remain aware of the big picture even in complex situations and take decisions despite uncertain circumstances, then you should join our team!

You are best equipped for those tasks if you have:
  • A Degree in Electrical Engineering, Physics or a related field
  • At least 10+ years of experience as platform or SoC architect in the area of microcontroller or microprocessor based products
  • Expert knowledge in following platform components: mixed-signal and power supply components, memories (DRAM, eNVM, external NVMs)
  • Expert knowledge in standard external interfaces (LPDDR, X-SPI, I2C, GETH, PCIe), automotive specific interfaces and newer chip-to-chip interfaces for SiP integration
  • Hands-on experience in product architecture documentation and requirements management
  • Basic knowledge in HW-SW dependencies, and digital/mixed signal design, packages and CMOS technologies is a plus
  • The ability to understand platform development trade-offs
  • Excellent technical leadership capabilities combined with good communication skills
  • Functional Safety and Security experience is a plus (e.g. experience with development according to ISO26262 or IEC61508 and ISO21434)
  • The ability to work in cross-functional teams and a multi-cultural environment
  • Fluent English communication skills is a must; German is appreciated

Benefits:
  • Coaching, mentoring networking possibilities
  • Wide range of training offers & planning of career development
  • International assignments
  • Different career paths: Project Management, Technical Ladder, Management & Individual Contributor
  • Flexible working conditions
  • Home office options
  • Part-time work possible (also during parental leave)
  • Sabbatical
  • On-site creche and kindergarden with 120 spots, open until 6pm
  • Holiday child care
  • On-site social counselling and works doctor
  • Health promotion programs
  • On-site gym, jogging paths, beachvolleyball, tennis & soccer court
  • On-site canteen
  • Private insurance offers
  • Wage payment in case of sick leave
  • Corporate pension benefits
  • Flexible transition into retirement
  • Performance bonus
  • Reduced price for public transport and very own S-Bahn station
  • Access for wheelchairs
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Details

  • Job Reference: 707423762-2
  • Date Posted: 8 September 2022
  • Recruiter: Infineon Technologies AG
  • Location: München, Bayern
  • Salary: On Application
  • Sector: Engineering
  • Job Type: Permanent